ELECTRODEPOSITED COPPER FOILS
Conventional Copper Foils
ML: ML is an IPC Grade 3, low profile, controlled elongation copper foil designed specifically for multilayer applications. ML foil is supplied with a TOB treatment which is fully compatible with all epoxy resin systems.
Benefits:
- Low profile for finer lines and consistent etching
- Decreased foil treatment residues after etching
- Controlled %E @ 180ºC for consistent drilling
- HTE characteristics eliminates inner layer foil cracking
Benefits:
- Lower profile for fine lines with consistent etching
- Excellent handling characteristics
- Superior drilling characteristics
- Consistent drilling characteristics
- TOB III: TOB III is a Grade 3 (HTE) copper foil with TOB treatment designed for multilayer constructions and is fully compatible with all epoxy resin systems.
Benefits:
- Zinc barrier layer promotes long term bond strength and resist "pink ring"
- HTE characteristics eliminates inner layer foil cracking
- Provides consistency in etching and drilling
High Performance Copper Foils
- MHT: MHT is a Grade 3 (HTE) copper foil with high temperature, heat resistance treatment designed for Polyimide and other high Tg substrates and low loss resins.
Benefits:
- Enhanced bonding treatment for Polyimide and other high Tg resins, results in improved adhesion
- MHT is low profile, for foil thickness less than 70 microns, for finer lines and consistent etching
- MLS: MLS is a reverse-treated, Grade 3, controlled elongation foil. This product is designed for inner layer applications where controlled impedance and high density, fine lines are required. MLS is supplied with a TOB treatment, which is fully compatible with all epoxy resin systems.
Benefits:
- VLP bonding surface, minimal foil treatment residues after etching
- Superior etch factor for fine lines
- Reduced costs through process step elimination during PCB fabrication
- HTE characteristics eliminate inner layer foil cracking
- MLS DBC: MLS-DBC is designed specifically for embedded passives or buried capacitance constructions. The uniform, ultra low profile of the primary bonding surface provides a minimum of surface penetration and a maximum of dielectric spacing enhancing electrical performance.
Benefits:
- Uniform, ultra low profile bonding surface
- Less prone to resist lock-in
- Compatible with ammoniacal etchants
- TOC 500: TOC-500 is a zinc-free copper foil designed for applications on PTFE (Teflon™) and other fluorocarbon resin-based, high frequency laminates.
Benefits:
- Excellent adhesion to high performance resin systems
- Stabilized shiny-side reduces oxidation for ease of processing
- Uniform surface minimizes signal loss
- MicroThin™: A very low profile 3µm or 5µm copper foil with an 18µm or 35µm copper peelable carrier for high density circuit applications. The releasing layer can be peeled-off after lamination. The released surface is very clean, therefore a mechanical or chemical cleaning process can be skipped. The removed 18 or 35µm copper carrier can be recycled as a high grade copper scrap.
Benefits:
- Enables very fine circuit pattern production, High Density Interconnect (HDI)
- Easy to release carrier after high temperature lamination
- Reduce size, weight and enhance high speed applications
Double Treated Copper Foils
- MLS-DBT: MLS-DBT is a double treated, reverse treat foil. MLS-DBT eliminates the need for oxiding and provides an opportunity to improve throughput and yield on thin laminates. The VLP surface combined with improved etching characteristics increase performance of controlled impedance designs and breaks the "5 mil" barrier associated with DBT's.
Benefits:
- Fine lines and spaces - 5 mils or less
- Compatible with ammoniacal etchants
- Increased yields on thin (<0.006") laminate
- Micro-treated re-lamination side reduces resist lock-in
- DBT-III: DBT-III double-treat is produced on a Grade 3 base foil with treatment applied to both matte and drum sides. These foils are designed for inner layer applications. The standard treatment is Treatment-of-Brass (TOB) for epoxy applications.
Benefits:
- Effectively eliminates "pink ring"
- Reduced cost with elimination of oxide process
- HTE characteristics eliminates inner layer foil cracking
Copper Foils for Flex Applications
- TOC-HD: TOC-HD is an IPC Grade 2 copper foil providing superior ductility for flexible Printed Circuit applications. This product is designed for flex-to-install applications.
Benefits:
- Excellent peel strengths to enhance reliability
- Excellent for High Frequency flexible laminates
- Cost-effective alternative to wrought and annealed foils
- TOB-HD: TOB-HD is an IPC Grade 2 copper foil providing superior ductility for flexible Printed Circuit applications. This product is designed for flex-to-install applications. TOB-HD is manufactured with a zinc treatment.
Benefits:
- Excellent peel strengths to enhance reliability
- Cost-effective alternative to wrought and annealed foils
- MFlex: MFlex is an electrodeposited copper foil for application on acrylic and polyester flex substrates. This product is designed for flex-to-install applications. MFlex meets all requirements of IPC Grade 2 copper foils.
Benefits:
- Excellent peel strengths to enhance PCB reliability
- Cost-effective alternative to wrought and annealed foils
- SuperFlex: SuperFlex is a super high elongation copper foil with a desirable combination of handling and ductility attributes developed for flex circuitry. Available in single or double-sided treatment.
Benefits:
- Cost effective replacement for RA foils
- High reliability in bend-to-install & low dynamic flex applications
- Lower profile for fine lines and consistent etching
- DBT version eliminates costs and enables processing of ultra-thin laminates
For additional information concerning electrodeposited copper foil products contact
John Blaber. [email protected] or (518) 686-4961.
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