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*FARADFLEX* offers advantages on: Enhancing decoupling and reducing power buss noise for high speed computing Enabling High Density Interconnects (HDI) for smaller, lighter, thinner circuits Accomplishing overall cost reduction Improved system reliability due to reduction in solder joints
	Material Data Sheet	PCB Examples
	MSDS	Impedance Chart
	Processing Guideline	IPACK03 Embedded Capacitor
	Technical Paper		Counter as of 06/30/04 000980

For additional information concerning Advanced Interconnect Materials (AIM) or Oak-Mitsui Technology products contact John Andresakis. [email protected] or (518) 686-4961.
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