ADVANCED INTERCONNECT MATERIALS (AIM)
OAK-MITSUI (OM) offers a family of resin coated copper products called MultiFoil. These products are utilized for high-density microvia applications including Build-Up-Multilayer (BUM). Thin copper with glass free resin allows the manufacturing of PCBs with 30-micron trace & space and 25-micron via diameters utilizing the existing PCB manufacturing infrastructure.
- MultiFoil- Resin Coated Copper Foil for Microvia Applications.
Benefits:
- Thin copper and glass free resin allows laser drilling of microvias
- Via holes in the core can be filled simultaneously by the resin from MultiFoil
- Utilize Conventional Lamination Process
- High reliability is assured with excellent peel strengths and high heat resistance
| Resin Type |
Resin Thickness |
Copper Foil |
Copper Thickness |
MR-500
(Tg 150° C)
MR-500/MR-600 Data Sheet |
30µm,50µm,65µm, & 80µm |
HTE, VLP, & MicroThin™ |
3µm, 5µm,12µm, & 18µm |
MR-600
(Tg 185° C)
MR-500/MR-600 Data Sheet |
30µm, 50µm,65µm, & 80µm
|
HTE, VLP, & MicroThin™ |
3µm, 5µm,12µm, & 18µm |
OAK-MITSUI also offers a Halogen & Phosphorus Free Resin Coated Foil called
MRG-100. This is an environmentally friendly "green" product that
performs well in high frequency applications.
For
additional information concerning Advanced Interconnect Materials (AIM) or Oak-Mitsui
Technology products contact John Andresakis.
[email protected] or
(518) 686-4961.
NOTE:
If you can not view the attached data sheets, please download and install Adobe
Acrobat Reader from
here.
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