ABC

ALUMINUM BONDED COPPER (ABC)

Aluminum Bonded Copper (ABC) represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC's product technology. Critical metal surfaces are cleaned then bonded without the use of any adhesive that could further interfere with the subsequent outer layer processing of the multilayer PCB. The use of ABC technology instead of the conventional component lay-up and wiping techniques ensures a process-ready fine line circuit board surface.

Benefits include:

Increase in Productivity

Less material handling, 11 components versus 31 in a 10-panel book

Increases the number of books in the lamination press

Reduction in Labor

No tack wiping of critical surfaces

Time savings of 30% to 60%

Less Material Handling

Reduced risk of operator induced defects

Fewer part numbers in inventory

Eliminates Handling Problems

Enhances registration and handling of thin copper foils

No wrinkles in copper, reduces the risk of pin holes & related defects

Higher First Pass Yields

Outerlayer circuit surfaces protected from airborne particulate during the lay-up process, leaving them resin spot free and dust free.

ABC Data Sheet in .pdf format.

ABC product is available with standard foils as well as Ultra Thin foils (12 & 9 microns). The Aluminum Separators are available with a thickness of .010", .012", and .015" with an H-19 or greater hardness specification.

For additional information concerning Aluminum Bonded Copper (ABC) products contact Darryl Giannetti. [email protected] or (518) 686-8041.
NOTE: If you can not view the attached data sheets, please download and install Adobe Acrobat Reader from here.